AttoTude Secures $52M in Series C Funding Round to Accelerate Interconnect Technology for Hyperscale Infrastructure


AttoTude is developing a new scale up interconnect category for large AI clusters that delivers reliable, low-power, and high-density connectivity built from ASIC and low-loss dielectric waveguides. Purpose-built around an ASIC over Dielectric architecture, the platform supports per-lane data rates of 200G, 400G, and 800G, enabling electrical connectivity that far surpasses the limits of conventional copper approaches. The solution also bridges a critical AI infrastructure gap by delivering scalable mid-range connectivity without the cost, power, reliability, and complexity penalties associated with optical technologies, while providing a path to support future high-speed interfaces.



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