“Through our unique DSP-based SerDes, manufactured using TSMC’s most advanced process nodes, our AI platform can deliver the performance required at the low-power levels needed via passive copper and low-power optical connectivity. This includes bringing optics to the XPUs and leverages the low power, high-efficiency benefits of UCIe die-to-die connectivity (below 1pJ/bit) while capturing the long reaches of optics,” said Mohit Gupta, Senior VP & GM, Custom Silicon & IP, Alphawave Semi. “Our portfolio of silicon IP subsystems are set to be the building blocks of the custom silicon and chiplets that make up AI platforms,” continued Mohit Gupta.